Ferdy88
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Hi,
I am making the layout on microstrip for a design of a medium power amplifier at 2.14 GHz. I have a problem about the use of a via hole to provide the ground at my circuitry.
The via hole leads to a significant reduction in gain from 14 dB to 10 dB.
Is it possible?
I am using ADS and my substrate MSUB has: H = 1.52 mm, Er = 3, Mur = 1,
Cond = 1.0e+50, Hu = 1.0e+036 um, T = 35 um, Tand=0.001, Rough = 0 um.
I want to know what are the most suitable parameters for the via hole and where
to find the theory about the via hole.....
I am making the layout on microstrip for a design of a medium power amplifier at 2.14 GHz. I have a problem about the use of a via hole to provide the ground at my circuitry.
The via hole leads to a significant reduction in gain from 14 dB to 10 dB.
Is it possible?
I am using ADS and my substrate MSUB has: H = 1.52 mm, Er = 3, Mur = 1,
Cond = 1.0e+50, Hu = 1.0e+036 um, T = 35 um, Tand=0.001, Rough = 0 um.
I want to know what are the most suitable parameters for the via hole and where
to find the theory about the via hole.....
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