RBTKraisee
Newbie level 2
Could someone please take a moment to explain what the technical blocker are, that currently prevent CPU's, DRAM, VNAND and all the appropriate controllers all being integrated together on a single SoC die?
I understand that economically it may not be an optimal solution. But cost-no-object, and assuming all the appropriate licenses are obtained, I would really like to put a block of DRAM on the same die as a small ARM CPU core, together with some VNAND storage on there too - and for this project I do not care about yield figures. Two different foundries have told me it can't be done on the same process. As a non-expert, I'm just trying to understand why not?
Thanks in advance, for any and all insights.
Ross.
I understand that economically it may not be an optimal solution. But cost-no-object, and assuming all the appropriate licenses are obtained, I would really like to put a block of DRAM on the same die as a small ARM CPU core, together with some VNAND storage on there too - and for this project I do not care about yield figures. Two different foundries have told me it can't be done on the same process. As a non-expert, I'm just trying to understand why not?
Thanks in advance, for any and all insights.
Ross.