Welcome to our site! EDAboard.com is an international Electronics Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.
here i mention some exposed pad in that footprint.please check it
- - - Updated - - -
check this link -https://www.edaboard.com/threads/24074/
in your design BGA ball size diameter is 0.45mm ,in BGA 80% ball is placed in assembly side so 0.45*0.8=0.36mm you have create ball size like this
This site uses cookies to help personalise content, tailor your experience and to keep you logged in if you register.
By continuing to use this site, you are consenting to our use of cookies.