Franck6367
Newbie level 2
Hi everyone,
In our lab, we are going to design with 65nm technology. I'm responsible of a team who's in charge of microelectronics integration. We'll have to bond on pad in 65nm technology and I have no idea for the pads size. We allready "wedge bonded" many and many chips with pad size around 100x80um but with 65nm I wonder what are the constraints. Wedge bonding is still suitable? Ball Bonding is necessary?
Thanks for your reply
In our lab, we are going to design with 65nm technology. I'm responsible of a team who's in charge of microelectronics integration. We'll have to bond on pad in 65nm technology and I have no idea for the pads size. We allready "wedge bonded" many and many chips with pad size around 100x80um but with 65nm I wonder what are the constraints. Wedge bonding is still suitable? Ball Bonding is necessary?
Thanks for your reply