bert_kak
Member level 5
- Joined
- Aug 24, 2009
- Messages
- 87
- Helped
- 19
- Reputation
- 38
- Reaction score
- 16
- Trophy points
- 1,288
- Location
- Philippines
- Activity points
- 1,829
I'm doing a PCB design with a Microprocessor & few DDR2 667MHz. The recommended layer stack up was TOP, GND, INN1, INN2, VCC, BOTTOM. Can you recommend thickness of the board(prepreg and conductor layers? Impedances from the board are 50 & 100ohms.
Also what will be the drill pairs from my board. I'll be using blind & buried vias.
Thanks
Also what will be the drill pairs from my board. I'll be using blind & buried vias.
Thanks