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its refer to the channel length (L). it is important to have a small channel length as you can save the chip area (WXL) while maintaining its drive strength or speed (W/L)
0.35 um technology
0.18 um technology
90 nm technology
all these number refer to minimum feature size in CMOS transistor,that is the size of the gate in the transistor, they refers to technology of the chip (size of the gate for the transistor) under which it has been manufactured.
"technology" refers to the minimum feature size. this is usually the transistor gate width. during design, the total chip area is divided into smaller grids of area 0.35um*0.35um or 90nm*90nm(depending on the technology being used), then all the other functional units are represented in terms of the chip area it occupies which in turn is in terms of the minimum feature size. also interconnect lengths on the chips(present manufacturing processes and CAD tools dont normally use diagonal interconnects) are given in multiples of the minimum feature size.
"technology" refers to the minimum feature size. this is usually the transistor gate width. during design, the total chip area is divided into smaller grids of area 0.35um*0.35um or 90nm*90nm(depending on the technology being used), then all the other functional units are represented in terms of the chip area it occupies which in turn is in terms of the minimum feature size. also interconnect lengths on the chips(present manufacturing processes and CAD tools dont normally use diagonal interconnects) are given in multiples of the minimum feature size.
"technology" refers to the minimum feature size. this is usually the transistor gate width. during design, the total chip area is divided into smaller grids of area 0.35um*0.35um or 90nm*90nm(depending on the technology being used), then all the other functional units are represented in terms of the chip area it occupies which in turn is in terms of the minimum feature size. also interconnect lengths on the chips(present manufacturing processes and CAD tools dont normally use diagonal interconnects) are given in multiples of the minimum feature size.
The effective length is strictly controlled in the IC manufacturing process. The Drawn length is only one aspect of effective length. Typically all wafers are tested prior to shipping out of the fab process to guarantee the effective length is under control. For 0.18um the Leff is typically about 0.13um. For 90nm, the Leff is about 65nm.
i asked this question in the class i am taking. The professor said it is the size of the channel length drawn on the layout.
don't know if the professor is correct.
i asked this question in the class i am taking. The professor said it is the size of the channel length drawn on the layout.
don't know if the professor is correct.
It's an interesting question and answers.... my company often use 0.25um,0.18um, 0.15um, 0.13umstandard but now nano technology is widely developed, does anyone know which company use this standard?
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