biff44
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Can someone school me on the TYPES of PACKAGING they are using on the next generation MMW chips for 5G smart phones in the 50-75 GHz range? I have been searching online for examples, but am not finding much on there, even though I KNOW they are already testing 5G phone prototypes in the field.
I am familiar with the standard solder attach plastic QFN type packages.
But are there new ones being used? Like flip chip thermosonic scrub attach? Some new type of wirebond chips with low dielectric glob top protection? a new type of solder package? Some sort of copper/molly tab mounted power amps?
I need to prepare a report on the types of attach/lead bonding equipment needed over the next 5 years to service the 5G phone business as it enters millimeter wave frequency range.
I am familiar with the standard solder attach plastic QFN type packages.
But are there new ones being used? Like flip chip thermosonic scrub attach? Some new type of wirebond chips with low dielectric glob top protection? a new type of solder package? Some sort of copper/molly tab mounted power amps?
I need to prepare a report on the types of attach/lead bonding equipment needed over the next 5 years to service the 5G phone business as it enters millimeter wave frequency range.