Terminator3
Advanced Member level 3
First case is DRO with parallel feedback.
Second case is Band-Pass-Filter microstrip feedback (DRO replaced with λ/4 microstrip).
First case is well known "cost effective" stable oscillator. Few MHz frequency drift is not a surprice for DRO. But it seems that it is not so cost effective: for desired frequency we need to buy alot of dielectic "pucks" if we want really cost-effective solution. Actually price for one DRO puck is higher than transistor and smds for small production. The only good thing about DRO i see is that it forgives many design errors.
Second case is Band-Pass-Filter microstrip feedback, rarely used. The most known area of usage is AIA (active integrated antennas) oscillators. In my opinion it is really cost effective solution. In this case we can produce oscillator for any desired frequency without "boring pucks". Again, only a Few MHz drift if substrate is stable enough over temperature range. With todays cheap microcontrollers, temperature measurement components in smd packages and varactors we can easily make frequency adjustement over temperature range. Also we get easier tuning, easier achieve repeatable oscillator design, easier to predict results in simulation software. No more "puck" tuning and gluing.
Also usage of BandPassFeedback oscillator gives us incredible strength against extremal temperature ranges, vibration and other unfriendly conditions. If we get more than 100°C, maybe even 150° or less than 30° many pucks will just peel off and say "bye-bye" to PCB. B-P-F Oscillator will just wait for good conditions and will work again nicely.
I want to understand what parameters we can compare? Why DRO is still widely used?
Second case is Band-Pass-Filter microstrip feedback (DRO replaced with λ/4 microstrip).
First case is well known "cost effective" stable oscillator. Few MHz frequency drift is not a surprice for DRO. But it seems that it is not so cost effective: for desired frequency we need to buy alot of dielectic "pucks" if we want really cost-effective solution. Actually price for one DRO puck is higher than transistor and smds for small production. The only good thing about DRO i see is that it forgives many design errors.
Second case is Band-Pass-Filter microstrip feedback, rarely used. The most known area of usage is AIA (active integrated antennas) oscillators. In my opinion it is really cost effective solution. In this case we can produce oscillator for any desired frequency without "boring pucks". Again, only a Few MHz drift if substrate is stable enough over temperature range. With todays cheap microcontrollers, temperature measurement components in smd packages and varactors we can easily make frequency adjustement over temperature range. Also we get easier tuning, easier achieve repeatable oscillator design, easier to predict results in simulation software. No more "puck" tuning and gluing.
Also usage of BandPassFeedback oscillator gives us incredible strength against extremal temperature ranges, vibration and other unfriendly conditions. If we get more than 100°C, maybe even 150° or less than 30° many pucks will just peel off and say "bye-bye" to PCB. B-P-F Oscillator will just wait for good conditions and will work again nicely.
I want to understand what parameters we can compare? Why DRO is still widely used?