Continue to Site

Welcome to EDAboard.com

Welcome to our site! EDAboard.com is an international Electronics Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.

Why can't we make connections on a wafer from the sides, why is it only from the top?

Status
Not open for further replies.

kaushikrvs

Member level 5
Joined
Jan 27, 2017
Messages
82
Helped
0
Reputation
0
Reaction score
0
Trophy points
6
Activity points
613
Why cant we make connections on a wafer from the sides, why is it only from the top ?

Why cant we make connections on a wafer from the sides, why is it only from the top ?
 

Re: Why cant we make connections on a wafer from the sides, why is it only from the t

A typical circuit has a seal ring around. That seal ring uses all metal layers. So there is no way to effectively reach the edge. Plus, edges are really rough after dicing. That signal wouldn't be able to go anywhere reliably.

If you are talking about uncut die, then yes, it is possible to connect multiple dies on the same wafer. It's not typical though, would require a foundry to play along. Which they will not do.
 

Re: Why cant we make connections on a wafer from the sides, why is it only from the t

Through-silicon via (TSV) processing either BEOL or
post-fab can get you access through the backside.
 

Status
Not open for further replies.

Part and Inventory Search

Welcome to EDABoard.com

Sponsor

Back
Top