JZJIANG
Junior Member level 1
Hi All,
I've just taped-out an LDO, and I'm going to package and test the LDO soon. I have several doubts about my subsequent work. I greatly appreciate your kind suggestions and advises.
Before I raise my questions, please first have a glance of some specifications of the LDO,
Input voltage:1.2V
Output voltage:1V
Max loading current: 200mA
Output capacitor: ~uF
Primary measurement parameters: PSRR, transient response, etc.
Below are my doubts/questions:
1. What type of package should I choose, (DIP or QFN or others)? It seems that the long bonding wire of DIP and the resultant parasitic inductance may degrade the performance of the LDO.
2. Should I solder the chip to the PCB (though expensive, the cost is not a big issue for my project) or should I use a socket? It seems that the socket brings high parasitic inductance. However, if I choose to solder the chip to the PCB, I'm afraid that the thermal issue may damage/stress my chip.
3. What kind of circuit should I adopt to emulate the loading, (resistor or current source or others)?
4. Any rule-of-thumb for the pertinent PCB design (e.g., the placement of the element, etc.)?
Looking forward to your reply.
Thank you in advance.
I've just taped-out an LDO, and I'm going to package and test the LDO soon. I have several doubts about my subsequent work. I greatly appreciate your kind suggestions and advises.
Before I raise my questions, please first have a glance of some specifications of the LDO,
Input voltage:1.2V
Output voltage:1V
Max loading current: 200mA
Output capacitor: ~uF
Primary measurement parameters: PSRR, transient response, etc.
Below are my doubts/questions:
1. What type of package should I choose, (DIP or QFN or others)? It seems that the long bonding wire of DIP and the resultant parasitic inductance may degrade the performance of the LDO.
2. Should I solder the chip to the PCB (though expensive, the cost is not a big issue for my project) or should I use a socket? It seems that the socket brings high parasitic inductance. However, if I choose to solder the chip to the PCB, I'm afraid that the thermal issue may damage/stress my chip.
3. What kind of circuit should I adopt to emulate the loading, (resistor or current source or others)?
4. Any rule-of-thumb for the pertinent PCB design (e.g., the placement of the element, etc.)?
Looking forward to your reply.
Thank you in advance.