lgarby
Newbie level 2
Hello,
I am creating a small PCB that basically condenses two usb jacks into one smaller socket. I want to maintain the standard 90 ohm differntial impedance between the diff pairs and It also needs to be emi shielded. my layer stackup I wanted to use is:
layer 1 - GND
layer 2 - usb 1 data and usb 2 power
layer 3 - usb 2 data and usb 1 power
layer 4 - GND
So basically Im sandwiching the signal planes between two ground pours. In order for Altium to run the diff pair routing, you need your diff pairs adjacent to an actuall power/gnd plane which would mean an extra 2 layers in the design. So i downloaded satrun PCB Design which is a software that lets your calculate deminsions for all sorts of pcb transmission lines. I chose the differential offcenter strip line but It doesnt seem to be giving me the proper outputs.
Is this the correct choice because layer 2 needs a reference to layer 1 and 4 which would make it off center. Likewise for layer 3. or am I missing something.
I am creating a small PCB that basically condenses two usb jacks into one smaller socket. I want to maintain the standard 90 ohm differntial impedance between the diff pairs and It also needs to be emi shielded. my layer stackup I wanted to use is:
layer 1 - GND
layer 2 - usb 1 data and usb 2 power
layer 3 - usb 2 data and usb 1 power
layer 4 - GND
So basically Im sandwiching the signal planes between two ground pours. In order for Altium to run the diff pair routing, you need your diff pairs adjacent to an actuall power/gnd plane which would mean an extra 2 layers in the design. So i downloaded satrun PCB Design which is a software that lets your calculate deminsions for all sorts of pcb transmission lines. I chose the differential offcenter strip line but It doesnt seem to be giving me the proper outputs.
Is this the correct choice because layer 2 needs a reference to layer 1 and 4 which would make it off center. Likewise for layer 3. or am I missing something.