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What happens during tapeout?

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diemilio

diemilio

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HI EVERYONE
Could someone please explain me what happens during tapeout???

thanks for your help,

diemilio
 

tapeout

your design becomes the realy chip
 

    diemilio

    diemilio

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Re: tapeout

You shall provide the GDSII file to your fab along with few more details required by fab. The semicon fab will develop mask based on your files. the mask will further developed as die and then bonding the pads and packings will make a ASIC
 

    diemilio

    diemilio

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Re: tapeout

So the fabrication, test on chip, and packaging occurs on this stage??? Or are they different steps?
 

tapeout

lvs and drc check must be done before tape out
 

Re: tapeout

It is a stage where you handover your chip design to the foundry like TSMC,UMC etc . You need to follow guidelines and fill the required data asked by the foundry. You have to make sure you design is clean in aspects like timing,DRC, LVS, Antena, Density, FIll before giving the data to the foundry.

Packaging and Testing is done later and tapeout has nothing to do with it
 

    diemilio

    diemilio

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Re: tapeout

it is being fabricated.
 

Re: tapeout

Tape out comes after,the completion of module level verification and full chip verification of the RTL, where it's layout is created and then it is given to the fabrication team. Then after the real sample comes out
 

Re: tapeout

Tapeout means all the design stages is complete i.e RTL Design, synthesis, Layout DRC, LVS and the design is ready to be fabricated. Let me know if this clarifies.
 

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