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i think salicide is the one where they use the cobalt to cover the whole die to reduce the resistance. and silicide is the one where they put the cobalt only over the gate poly.
silicidation is used to decrease the resistance of the contact this is done by adding some Si compounds called silicides "they are also called refractory metal for example Tnagestun (W)) , this process also prevents the Al from shorting the drain/source cause of its solubility in Si "this problem called pitting".
silicides are also added to polysilicon forming polysides which decrease the polysilicon resistance.
the procees of siliciding the contact cut and polysilicon is called salicidation as in self alligned sillicide. where both process are done in one step.
as far as i could rememberthe process is followed by heating process called RTA "rapid thermal anealing"
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