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a long time ago i've heard about some issues with wire bonding with gold wire on aluminum pads.
tried to findout something about that but i don't find anything.
any ideas if there are any issues with that [gold wire bonding on al pad] or not?
so, i understood next
1. there are typical pads used for the placing bumps or stick the wires (for flip chip and wire bond cases)
2. typically there are ESD/latch-up (btw, what does latch-up mean in few simple words?) protections between io and pads
Hello, does anybody can advise what restrictions for current through vias of package substrate and so on for the bump-ball interconnections?
what parameters influence on this (max current) value (material, thickness?)?
apreciate your help.
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as i understand there are next...
Hi All,
please advise the first steps in study in packaging area for ASIC designs.
books (IC Layout Basics - A Practical Guide?)/approaches/etc
for example what are the key advantages of flip chip against wire bond?
in case of io placed on perimeter of die, with low lead number. does it mean...
Re: What is "thermal via" in substrate of package
thanks a lot for overview, does it work for as well for plastic packages as well?
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thanks a lot for overview, does it work for as well for plastic packages as well?
for my understanding (please correct me if i'm...
unfortunately didn't find exact explanation of what is "thermal via" what is the main difference to simple via.
please explain. sorry for dummy question.
technology 40lp, there is no a lot of information regarding that.
but if talk about the possibility - i didn't find info about area-IO, would you be so kind to advise such?
so the question is in subject - please help me with area I/O libraries, what would you advise?
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it about which shown on (b) image
**broken link removed**
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