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Hi all,
the transplant PCB means the X-out PCB:
http://us.jetpcb.com/service/faq_detail.aspx?CategoryID=17&fid=445&b=h
http://www.dataweek.co.za/news.aspx?pklNewsId=25207
If anyone has more info how the PCB maker manage this process, can you share with me. My company is initiating a project...
Hi marce,
I like your idea of update the dxf filename with version/numbers.
About correlate to other data, it means if we don't follow the latest DXF, then we can't proceed to nxt process right? But I need some examples to be clearer...
TQ!
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I can think of one. Do DXF...
Hi,
I come across the term transplant PCB.
It means if the PCB panel has 2 cavity,
and if cavity 1 quality has problem,
PCB maker will take it out and proceed
manufacturing of cavity 2.
Can anyone share more details?
Thanks!
Hi,
recently my colleague did a mistake.
He forgot to import the latest DXF into the PCB data and modify accordingly.
May I know what is the best preventive counter measure to avoid repeating the mistake?
Thanks!
Hi, may I know if mouse bite design is applicable for 1) FR-4 PCB material
and 2) automatic cutter instead of hand separation process?
Thanks!
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attached is the mouse bite design
The problem is before soldering process, the board warps more (initial condition).
Soldering process only slightly increase the warp value...
can't go for double-sided because cost up...
hi Barry, our members went to the PCB maker site, they found the boards were within specs.
Usually maker will send to us immediately after the PCB has been made.
But when the boards reached us, it was warped.
currently this board has solder mask at one side of board only,
i am thinking whether solder mask at both side will improve the board or not.
means : A side: copper and solder mask
B side: no copper, but have solder mask
Hi Barry, thanks for the reply
Initial condition means from the manufacturer (blank board).
Soldering process is reflow (lead free solder)...
board stiffeners / pallette is not preferable by production because cost reason...
headache..
thanks!
Hi,
i am facing problem with pcb warpage (>1.5mm) at initial condition.
Any novel solution?
I tried, different cavity direction, add/remove copper, but still fail.
Thanks!
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here is the image of my board
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