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The manufacturing process of DOUBLE LAYER PCB BOARD
1 Plot negative film ( photo-plot the negative drawing );
2 Cutting the copper clad laminate ( keep20mmbreak-tab )
3 Drilling hole ( LAMINATE thickness is2.0mm, from drilling bit point to LAMINATE is 1.0-1.5mm, from the...
PCB Reverse Engineering, also known as PCB CLONE or PCB Copy, is using clone technology onto the PCB which was designed and manufactured by others, it is to use PCB related software to copy someone else’s circuit board and then manufacture the circuit board by yourself. This is the tradditional...
Flexible circuits offer some unique challenges to the assembly process. The assembly materials and processes for populating and interconnecting components to a flexible circuit range are essentially identical to those used for standard rigid or rigid flex pcb, but there are some twists required...
1.) seperate the power grounds, signal grounds, analog grounds, digital grounds, control grounds
2.) Keep inputs and outputs seperated and isolate to prevent oscillations
3.) Oscillation can happen from the inverting input and non-ineverting input of op-amps, coupling between parallel signal...
As is well known, solderability is very important for the printed circuit boards, we must do solderability test of each batch PCB we made. In this way we can inspect the weldability of the PCB before we go ahead the assembly process, much helpful for SMT.
Today we are going to discuss the...
Stencil Types
Important print quality variables include accuracy and smoothness of the stencil aperture sidewalls. Maintaining a proper aspect ratio between stencil width and thickness is important. The recommended aspect ratio (aperture width divided by stencil thickness) is 1.5. This is...
Annular Ring
The remaining area of a pad after a hole is drilled through the pad. It is a circular ring of conductive foil and plating material.
AOI
Automated optical inspection.
Aperture
A description of the shape and size of the tool used to create a pad or track. The term comes from...
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