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Normally, Pouring ground on pcb esp 2 layers to help current easily find the path of low inductance also reduce emi. But you must sure that the gound pour is connected to ground at appropriate location.
1)if you have inner layers... it also act as shield for your traces in the inner layers
2)allows you to add decoupling caps at IC power/ground pins and not worry that the inductance of long power traces will render the decoup cap useless
3)for very high freqs & high capacitance thin dielectric layer... the power/ground plane can actually act as decoupling caps... but only for a short time.
4)ground pour between signal traces can actually reduce cross talk as the parasitic cap will now not occur between the traces... rather between trace and ground pour.
also for inner layer traces .... if you use outer layers as ground and power
5)to be able to add correct termination resistors... we need to know the exact impedance of the trace. Adding a ground plane allows us to have a more or less constant characteristic impedance.. so not only does this reduce reflections but also enable us to put correct termination resistors...
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