Continue to Site

Welcome to EDAboard.com

Welcome to our site! EDAboard.com is an international Electronics Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.

Whats the difference between the bonding pad and the iopad?

Status
Not open for further replies.

zqihong

Newbie level 4
Joined
Mar 4, 2006
Messages
7
Helped
0
Reputation
0
Reaction score
0
Trophy points
1,281
Activity points
1,321
a question on the pad

anyone could tell me the difference between the bonding pad and the iopad?
thanks!
 

Re: a question on the pad

IO pad is most-probably a digital band with digital input/output buffers to drive digital data from/to external world.

Bonding pads are just stacks of metal layers used to connect some external signal to the chip ( for example the Vdd and ground pads )
 

    zqihong

    Points: 2
    Helpful Answer Positive Rating
Re: a question on the pad

io pad generally used in digital circuits which consists of many driver circuits and some hystersis circuits too.
but bonding pad has only the metal patches.
regards
 

Status
Not open for further replies.

Part and Inventory Search

Welcome to EDABoard.com

Sponsor

Back
Top