what the max current value for the die bump to package ball connection (through via)

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R1kky

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Hello, does anybody can advise what restrictions for current through vias of package substrate and so on for the bump-ball interconnections?

what parameters influence on this (max current) value (material, thickness?)?

apreciate your help.

- - - Updated - - -

as i understand there are next vias type

 

As you correctly state, bump-ball interconnection resistance depends - apart from the vias' resistance - on material and bump diameter. Generally one can say, bump connections are thicker and shorter than comparable wire bond connections: e.g. a 25µm thick and 1mm long gold wire can be used for up to 400mA. A 75µm diameter gold bump on the same pad size of course is much shorter (50 .. 100µm) and its heat transfer is much better, so could stand a lot more current (order of ampères).

In such case, the current more likely is limited by the vias' resistance, I think.
 

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