Electromigration is a mass transport of metal atoms in direction of electrons due to this current density increases and Metal resistance increases .Electromigration mainly occur in POWER pads and signal nets .Temperature and AC signals also Effects EM.Solution is Increase Width of wire and decreasing no of contacts for specified area .
IT is a seriuos issue when designing system which haev minor circuit paths (microprossors). because even a minor electronmigration could detoriate the performance of the processor, and render is useless
Electromigration is generally considered to be the result of momentum transfer from the electrons, which move in the applied electric field, to the ions which make up the lattice of the interconnect material.
what is the differance between lattice diffusion and grain boundary diffusion in metals, while undergoing electromigration.another question,can electromigration take place in semiconductorsb also?