What does flipchip design mean?

[aravind]

what is flipchip design

hi friend
what is the meaning of flipchip design

 

[echo47]

what is flipchip design

It's one type of BGA package. See Xilinx "Device Package User Guide". Search for section titled "Flip-Chip BGA Packages":
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[moneychaser]

what is flipchip design

There are two main differences between wire-bond and flip chip.

- In wirebond, the I/O pads are placed around the die. In flip-chip, they are placed all over the die.
- In wirebond, the die has the top metal layer facing up, in flip chip, the die is flipped upside down (hence the name), with the top metal layer facing down

 

[anjali]

Re: what is flipchip design

flip chip means, the ios will be placed on bottom of the die also, not only in sides.

 

[Son]

Re: what is flipchip design

- In wirebond, the I/O pads are placed around the die. In flip-chip, they are placed all over the die.

Not necessary. Both placement types exist on each technology.

 

[urslen]

Re: what is flipchip design

aravind, you can find more details from these sites:
www.amkor.com/enablingtechnologies/FlipChip/index.cfm

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Advantage of flipchip (from these website)
•Reduced signal inductance
•Reduced power/ground inductance
•Higher signal density
•Die shrink
•Reduced package footprint