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What does flipchip design mean?

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aravind

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what is flipchip design

hi friend
what is the meaning of flipchip design
 

echo47

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what is flipchip design

It's one type of BGA package. See Xilinx "Device Package User Guide". Search for section titled "Flip-Chip BGA Packages":
**broken link removed**
 

moneychaser

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what is flipchip design

There are two main differences between wire-bond and flip chip.

- In wirebond, the I/O pads are placed around the die. In flip-chip, they are placed all over the die.
- In wirebond, the die has the top metal layer facing up, in flip chip, the die is flipped upside down (hence the name), with the top metal layer facing down
 

anjali

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Re: what is flipchip design

flip chip means, the ios will be placed on bottom of the die also, not only in sides.
 

Son

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Re: what is flipchip design

moneychaser said:
- In wirebond, the I/O pads are placed around the die. In flip-chip, they are placed all over the die.
Not necessary. Both placement types exist on each technology.
 

urslen

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Re: what is flipchip design

aravind, you can find more details from these sites:
www.amkor.com/enablingtechnologies/FlipChip/index.cfm

**broken link removed**

Advantage of flipchip (from these website)
•Reduced signal inductance
•Reduced power/ground inductance
•Higher signal density
•Die shrink
•Reduced package footprint
 

    aravind

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