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One additional comment about "thieving". The term is used in two different meanings.
1. adding copper features to help in uniform galvanic plating, as explained by marce in post #15
2. adding dummy pads to improve wave soldering results with SMD components glued to the PCB bottom side.
Obviously none of these cases applies to the presently discussed board, but if at all, it would be solder rather than galvanic thieving.
1. adding copper features to help in uniform galvanic plating, as explained by marce in post #15
2. adding dummy pads to improve wave soldering results with SMD components glued to the PCB bottom side.
Obviously none of these cases applies to the presently discussed board, but if at all, it would be solder rather than galvanic thieving.