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i know that in case of 28nm poly space effect and OD space effects will come into picture...but rest of this are there any major differences between these two technology nodes?
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Poly pitch have to be maintained in lower node technology.
No orientation of poly is used.
Special layers such as cut poly is used in lower node technology.
We maintain the Poly pitch in lower node technology due to process effects.
As shrink size is reduce, the chip is more prone to get affected due to process window variation in fabrication.
So, we maintain constant space for poly pitch and the here the process is Dual Pattern Technology .
You can read about Dual Pattern Technology to understand the scenario better.