frankrose
Advanced Member level 3
Hi all,
I have just read that reference circuit's long-term stability (>1000 hours accuracy) depend on packaging material a lot.
I am wondering what else can influence it if there any other factors which can be influenced by designer?
Like:
- technology used (manufacturer, process differences, number of used masks, buried/epitaxial/metal layer's effect, the type of devices, lateral/vertical transistors, leakage, etc.)
- circuit implemented (difference between circuit architectures, curvature compensation methods, bandgaps with/without OPAmps are better, auto-zero/choppering used or not, impedance level regarding noise, low flicker noise is essential, etc.)
Or simply packaging is the key element in long-term stability?
If you have any experience with design for long-term stability, please won't hesitate to share. Thank you in advance!
I have just read that reference circuit's long-term stability (>1000 hours accuracy) depend on packaging material a lot.
I am wondering what else can influence it if there any other factors which can be influenced by designer?
Like:
- technology used (manufacturer, process differences, number of used masks, buried/epitaxial/metal layer's effect, the type of devices, lateral/vertical transistors, leakage, etc.)
- circuit implemented (difference between circuit architectures, curvature compensation methods, bandgaps with/without OPAmps are better, auto-zero/choppering used or not, impedance level regarding noise, low flicker noise is essential, etc.)
Or simply packaging is the key element in long-term stability?
If you have any experience with design for long-term stability, please won't hesitate to share. Thank you in advance!