I have done similar in previous jobs.
Some more:
Damaged IC packages indicating internal heating (EG. A bulge on a SOT23 transistor may indicate a failure).
Inspection of adequate heel and toe solder fillets on SMT IC legs.
PCB silk-screen legend interfering with soldering (both SMD and PTH).
Soldering defects including: Solder balls (you don't want these), blow-outs (caused by gassing in through-plate barrels during cooling), poor pull-through (usually a flux issue or contaminated barrels).
SMD "tomb-stoning", chip style components on their side (sometimes this is the component being picked up wrong).
Chip style components fractured due to incorrect insertion pressure or wrong pick & place machine nozzle used.
Component alignment (can be a flux issue or temperature in reflow).
SMD glue covering solder pads.
The SEHO site used to have some good information on soldering defects but that was a few years ago, maybe they still do? seho.de (language options at top).