jevons9958
Newbie level 3
Hey, I have two questions here need some advices.
For the tuning varactors, how can I bond them with the short-circuited stubs fabricated on RT/Duroid substrate? The stubs widths are 750µm. Can I use wire/ribbon bond? Or I just solder them togehter? The whole device will operate at X-band. I've read many papers but can't find any answers till now.
My second question is about the via/grounding tehcnique.
Once I designed an X-band BPF using 4 short-circuited stubs that are λg/4 long with with three connecting lines λg/4 long also. However, due to the poor via method, the measured S21 is much worse if I use the open stub technique. I grounded those stubs using silver paster which seems not a good way at all.
So, could you please give me some advice on how to ground those short-circuited stubs?
Thanks,
Joe
For the tuning varactors, how can I bond them with the short-circuited stubs fabricated on RT/Duroid substrate? The stubs widths are 750µm. Can I use wire/ribbon bond? Or I just solder them togehter? The whole device will operate at X-band. I've read many papers but can't find any answers till now.
My second question is about the via/grounding tehcnique.
Once I designed an X-band BPF using 4 short-circuited stubs that are λg/4 long with with three connecting lines λg/4 long also. However, due to the poor via method, the measured S21 is much worse if I use the open stub technique. I grounded those stubs using silver paster which seems not a good way at all.
So, could you please give me some advice on how to ground those short-circuited stubs?
Thanks,
Joe