If you are preparing such a mixed technology board for wave soldering you should do this.
Never try to wave solder a fine pitch part, if you must make sure it can be suitable for wave solder in first place, see posts above.
Make all fine pitch parts on bottom (solder lead side) reflowed first, then reflow top side second.
If you have large parts, 0805, o603 and you really want to wave solder them , you can glue and place them now.
Before flow (wave) soldering you should make a wave solder pallet or carrier which has been made for this board, the pallet should only have apertures around the leaded parts you wish to solder and mask off the other areas like your TSOP. Most likely you will have to landscape or contour the surface of the pallet so that there are pockets machined out for the bottom side parts like your TSOP to sit into, that way the board will mount flat on the pallet.
To do this your wave solder machine will need to have a pressure wave (2 preffer) as well as a bath as the underside pockets in the pallet will be deep because of the masking of the other parts. If you have gas expansion issues in small pockets you migh need to make a small cut out from the pocket to the outside edge but then you should just use the pressure wave & skip the bath phase.