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There was also PakSi software, primarily package-centric:
PakSi-E for package parasitics extraction and
PakSi-TM for package thermomechanical simulation,
It was I would say pretty good and simple to use, as far as I know Cadence tries now to integrate PakSi-TM into their package design suite.
any one heard of the tool name TASPCB from Harvard Thermal?
This is very good thermal analysis for pcb. It can interface to pcb database thru CAMCAD software so you don't have to create the model from scratch. Once you bring the pcb db into TASPCB, all the power/gnd planes as well as the signal traces are included in the model. Therefore, the result of the analysis is very accurate.
u may use $EMCAD: h44p://www.semcad. com/, especially if you considering an rf circuit thermal condition.
u may check : h44p://www.semcad. com/solver_thermal.html
Sequential simulations of thermal and electromagnetic effects
Coupled processing (thermal and EM)
Thermal- and EM-simulation on the same mesh (no regeneration of grid necessary)