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the size is not big enough to place all pads- need help

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handsome

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die size staggered pad

Hi,all
In my project, die size is not big engouth to place all pads which use wire bongding.
How can I slove this problem?I dont want to add the die size.
Thx.
 

jbeniston

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die size and pad numer

Use staggered pads instead of inline pads if you have them. Use flip chip instead of wire bond.
 

handsome

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die size and pad numer

jbeniston said:
Use staggered pads instead of inline pads if you have them. Use flip chip instead of wire bond.

Thx.

I have used staggered pads.

Flip chip will need more money. And I am not familiar with the FC‘s backend flow。

Can you tell me the difference between the nomal wire bonding PR flow and the FC's PR flow?

Added after 1 minutes:

Can anyone explain the "multi tier packages"?
 

hiral.kotak

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Re: die size and pad numer

Hi,

staggered pad approach is the good one. u can also use radially staggered pad placement.

thanks..

HAK..
 

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