The differences between SS and SO packages

[hkBattousai]

smd package types

Screenshots from Altium Designer 08 :
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Can you tell me differences between SS and SO packages?
What other package types exist and why do we use them?
What are the standard names for these packages?

 

[abhi002]

smd package

you should see IPC 7351 land pattern calculator..it will solve all your queries

 

[senilicus]

smd packages

Well to say it out loudly "Size does matter".


have a look at the attached document.

 

[hkBattousai]

smd packages types

have a look at the attached document.

The document explains most of the things. But it doesn't give the meaning for the abbreviations. How can I learn them?

 

[senilicus]

types of smd packages

Well, here are some;

BGA: Ball Grid Array
BQFP: Bumpered Quad Flat Pack
CBGA: Ceramic Ball Grid Array
CFP: Ceramic Flat Pack
CPGA: Ceramic Pin Grid Array
CQFP: Ceramic Quad Flat Pack
CLCC: Ceramic Lead-Less Chip Carrier
DLCC: Dual Lead-Less Chip Carrier (Ceramic)
FBGA: Fine-pitch Ball Grid Array
fpBGA: Fine Pitch Ball Grid Array
JLCC: J-Leaded Chip Carrier (Ceramic) J-Lead Picture
LCC: Leaded Chip Carrier [also Leadless] LCC Graphic
LCCC: Leaded Ceramic Chip Carrier;
LFBGA: Low-Profile, Fine-Pitch Ball Grid Array
LGA: Land Grid Array [Pins are on the Motherboard, not the socket]
MLCC: Micro Leadframe Chip Carrier
PBGA: Plastic Ball Grid Array
PLCC: Plastic Leaded Chip Carrier
PQFD: Plastic Quad Flat Pack
PQFP: Plastic Quad Flat Pack
PSOP: Plastic Small-Outline Package
QFP: Quad Flatpack
QSOP: Quarter Size Outline Package
SOIC: Small Outline IC
SOJ: Small-Outline Package [J-Lead]
SSOP: Shrink Small-Outline Package
TQFP: Thin Quad Flat Pack
TSOP: Thin Small-Outline Package
TSSOP: Thin Shrink Small-Outline Package
TVSOP: Thin Very Small-Outline Package
VQFB: Very-thin Quad Flat Pack
COB: Chip On Board