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The differences between SS and SO packages

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hkBattousai

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smd package types

Screenshots from Altium Designer 08 :
ssei7.jpg
65214676bv7.jpg
somy4.jpg


Can you tell me differences between SS and SO packages?
What other package types exist and why do we use them?
What are the standard names for these packages?
 

abhi002

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smd package

you should see IPC 7351 land pattern calculator..it will solve all your queries
 

    hkBattousai

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hkBattousai

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smd packages types

senilicus said:
have a look at the attached document.

The document explains most of the things. But it doesn't give the meaning for the abbreviations. How can I learn them?
 

senilicus

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types of smd packages

Well, here are some;

BGA: Ball Grid Array
BQFP: Bumpered Quad Flat Pack
CBGA: Ceramic Ball Grid Array
CFP: Ceramic Flat Pack
CPGA: Ceramic Pin Grid Array
CQFP: Ceramic Quad Flat Pack
CLCC: Ceramic Lead-Less Chip Carrier
DLCC: Dual Lead-Less Chip Carrier (Ceramic)
FBGA: Fine-pitch Ball Grid Array
fpBGA: Fine Pitch Ball Grid Array
JLCC: J-Leaded Chip Carrier (Ceramic) J-Lead Picture
LCC: Leaded Chip Carrier [also Leadless] LCC Graphic
LCCC: Leaded Ceramic Chip Carrier;
LFBGA: Low-Profile, Fine-Pitch Ball Grid Array
LGA: Land Grid Array [Pins are on the Motherboard, not the socket]
MLCC: Micro Leadframe Chip Carrier
PBGA: Plastic Ball Grid Array
PLCC: Plastic Leaded Chip Carrier
PQFD: Plastic Quad Flat Pack
PQFP: Plastic Quad Flat Pack
PSOP: Plastic Small-Outline Package
QFP: Quad Flatpack
QSOP: Quarter Size Outline Package
SOIC: Small Outline IC
SOJ: Small-Outline Package [J-Lead]
SSOP: Shrink Small-Outline Package
TQFP: Thin Quad Flat Pack
TSOP: Thin Small-Outline Package
TSSOP: Thin Shrink Small-Outline Package
TVSOP: Thin Very Small-Outline Package
VQFB: Very-thin Quad Flat Pack
COB: Chip On Board
 

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