Testing high frequency signal

[tasctasc]

I need to measure a high frequency signal on a chip using probes, however have multiple other signals controlling the circuit so need to package (wire bond) the chip. Essentially I will be trying to probe (usng GSG probes) a packaged chip. Just wondering if anyone has had any experience with this. Specifically I am concerned about the probes damaging the bond wires when they contact the die.

 

[Teddy]

Just be very patient and don't rush. If you never used probe before use some "training" die. Other than that you should be fine. Just don't touch the bondwires. If those do not have high loops you will not have a problem.