chungylau
Newbie level 3
We noticed that after a die is packaged in BGA and subjected to high humidity and temperature, 85C/85%, for 96 hours, the momcaps on the die appear to have shifted in value. They seem to be 10 to 20% higher than before. This is a 90nm low-leakage RF CMOS process. Our VCO's also seem to have reduced loop gain, perhaps due to the momcaps in the resonator being more lossy after moisture tested. Has anyone seen anything like this? Different molding compounds do not seem to help.
When we moisture-test the wafers (unsawn and ungrinded), we don't observe this shift. We grind the wafers to either 5 mil or 10 mil thickness before assembly.
When we moisture-test the wafers (unsawn and ungrinded), we don't observe this shift. We grind the wafers to either 5 mil or 10 mil thickness before assembly.