Stitching ground planes, the more the better?

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blapcb

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On a dual layer board there are ground planes on top and bottom. It is a good/best practice to stitch them with vias as much as possible? (i.e. the more the better?)
 

In my opinion stitching copper pours on top and bottom layers to effectively get more copper area is a good plan. Equally spaced stitching (PTH) vias will do a better job than randomly scattered Vias.
 

The count of the vias depends upon the signal frequency used. The shorter wave transmitted, the more and closer vias are needed.
 

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