spacing between two devices/metals as per the technology

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when we have two different potentials in our circuit. Then in layout we put some spacing between those two devices/metals as per the technology
can anyone please tell me the reason for that (i know one reason i.e, due to noise frequency cross talk may occur,other than this is there any reason)


thanks
layout
 

Regardless of potential there is a minimum spacing that can be
reliably patterned by the lithography tools of the process flow.

There may be additional reliability / defectivity related rules for
high voltages when they demand more that the lithography
minimum.

Thin oxide reliability starts to worry around 7MV/cm. The
deposited dielectrics, and the "seams" between layers,
may withstand less.

Technology docs ought to tell you whether there's any
special voltage/distance concern.
 

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