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Solder msop-8 max temperature ?

FvM

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150° maxiumum temperature isn't specific to these packages, you'll find similar specs for most semiconductor devices, IC and discretes. They are nevertheless designed for lead-free solder process with necessary temperatures, you find reflow temperature profiles in datasheets and application notes.

A special problem of very thin packages (smaller than MSOP) is their maximum "floor live" after been taken out of the sealed dry bag. Before reflow soldering, they need baking. Read about MSL https://en.m.wikipedia.org/wiki/Moisture_sensitivity_level
 

rompelstilchen

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I dont have any reflow aparatus, just my soldering iron

there is no MSL nor reflow temperature info in the datasheet
 

KlausST

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FvM

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This MSOP package has no exposed pad and can be well soldered with fine soldering iron tip.
 

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