I would say test points too. Typically a board like that would be tested on a "bed of nails", a fixed platform with locating pins to align the board and spring loaded test probes to touch those solder dots. The probes would have wires going to test equipment. An operator would place the board on the pins and lock it down so pressure was applied to the probes then the tester would inject or measure signals at the probes to check functionality. It's a quick way to connect lots of test equipment without having to attach wires. Probing on component legs is normally avoided as the probe pressure could influence a poor solder joint and hide it.
Brian.