Soild vias connection VS Via connection with thermal spokes

[samym]

Hi,

I am designing the PCB board with high current carrying load,for that i am planning to put copper shape in all 4 layers with stitching vias.

For vias connection which option will be better one ,either full solid connection or spokes?

FYI:Here there will be more heat generated, due to high current carrying,we need to dissipate the heat.

Thanks,
samy

 

[KlausST]

Hi,

usually vias don´t have thermals at all.
(Only THM pads).
Thermals improve THM soderability when a pad is connected to a large copper area.
Vias don´t need to be soldered, therefore there is no need to use thermals.
(Maybe there a special conditions...that recommend thermals on vias. Then tell us)

Klaus

 

[samym]

Hi Klaus,

You are right,but my question is for heat dissipation which kind of via connection solid or spokes would be better one.

Thanks,
samy

 

[KlausST]

Hi,

It´s very clear:
* You know: thermal prevent heat transport, but you expressly want heat transport --> don´t use thermals
* I said: "there is no need to use thermals." --> don´t use thermals.

Go through the links in the box "similar threads" below.

Klaus