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Not true. Wave soldering was used a lot when surface mount was introduced. I seem to remember the pads were different. For wave they need to be oversized. For reflow they can be smaller than the component pad in some cases.
Not true. Wave soldering was used a lot when surface mount was introduced. I seem to remember the pads were different. For wave they need to be oversized. For reflow they can be smaller than the component pad in some cases.
Try and find some old device data sheets. I seem to remember they would give two land patterns depending on soldering method. Motorola and Philips discretes for example.
I was looking at the Yageo 1206 resistor patterns. They had recommended a wave soldering pattern and reflow pattern for surface mount PCBs. Since my only knowledge was in through hole PCBs I needed wisdom from other designers on the world of surface mount PCBs.
Originally I had designed my PCB with the wavesoldering footprint and the I discovered that the Company that was going to assemble the PCBs uses reflow. So I was wondering if any one had actually put a PCB with the wave solder footprints through the relow process. How would the boards turn out???
Is the reflow process of soldering the new standard in the surface mount world??
I doubt anyone uses wave for surface mount any more (I may be proven wrong in a few seconds by someone!). I wouldn't expect any particular problems using wave footprints for reflow soldering, but the other way round would be a problem, I think.
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