Really, i'll take a look at that. thanks for the info.Not true. Wave soldering was used a lot when surface mount was introduced. I seem to remember the pads were different. For wave they need to be oversized. For reflow they can be smaller than the component pad in some cases.
Thanks Keith, I just remember seeing like these before but I never used the wave soldering pattern.There is some info here: http://www.kemet.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/64F3744BFC060EE985256BCD004EBC13/$file/F2105A.pdf
Here is an AVX data sheet which gives wave and reflow land patterns.