Welcome to EDAboard.com

Welcome to our site! EDAboard.com is an international Electronic Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.

Register Log in

SAW Filter On chip - any information about it?

Status
Not open for further replies.

cwcwecan

Junior Member level 3
Joined
Apr 14, 2002
Messages
27
Helped
0
Reputation
0
Reaction score
0
Trophy points
1,281
Activity points
126
SAW Filter On chip

Hi!

In Order to cost down the prize, we can design on chip SAW Filter
Does Anyone have information about this?
THanks!
 

flatulent

Advanced Member level 5
Joined
Jul 19, 2002
Messages
4,629
Helped
489
Reputation
980
Reaction score
150
Trophy points
1,343
Location
Middle Earth
Activity points
46,689
substrate

SAW filters are built on piezoelectric material. I would suspect that adding this to silicon wiould be more expensive than the current method of having the filter in its own package.
 

BigBoss

Advanced Member level 5
Joined
Nov 17, 2001
Messages
4,807
Helped
1,454
Reputation
2,906
Reaction score
1,309
Trophy points
1,393
Location
Turkey
Activity points
29,018
Re: substrate

flatulent said:
SAW filters are built on piezoelectric material. I would suspect that adding this to silicon wiould be more expensive than the current method of having the filter in its own package.
But adding saw filter with a tranceiver IC on a same substrate may be cheaper than expected.

Consider passive integration on a Si substarte and a flipped transceiver IC on this substrate :!:

TRX SAW
[------------] [------]
!--!-----------!---!----!------!
[_____________________]

something like that.. Considerable huh ?

GL
 

flatulent

Advanced Member level 5
Joined
Jul 19, 2002
Messages
4,629
Helped
489
Reputation
980
Reaction score
150
Trophy points
1,343
Location
Middle Earth
Activity points
46,689
hybrid

I agree that the old hybrid technology which has now evolved into the multiple chip on a single carrier technology could have advantages. It would for one allow the whole system to be put into a single shielded package with improved EMI performance. Taking up silicon area to just mount the filter would be very expensive as the filters are many times larger than the silicon circuit.

The stacking method could further shrink the size.

As historic interest, the three dimensional IC was discussed in a sophmore level transistor textbook in 1957. We have yet to find economic ways to make them.
 

Status
Not open for further replies.
Toggle Sidebar

Part and Inventory Search

Welcome to EDABoard.com

Sponsor

Top