Welcome to our site! EDAboard.com is an international Electronics Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.
Salicide is a layer used to increase the sheet resistance of poly, source/drain diffusions.. this layer will be put after the source/drain diffusions and before metal contact is done. This is layer which is put above the source/drain diffusions.. so you can connect the n-diffusion and p-diffusion just by abutting without the need of metal to connect. The salicide layer will form the connection between them.. this may help u in solving the error..
Salicide is a layer used to increase the sheet resistance of poly, source/drain diffusions.. this layer will be put after the source/drain diffusions and before metal contact is done. This is layer which is put above the source/drain diffusions.. so you can connect the n-diffusion and p-diffusion just by abutting without the need of metal to connect. The salicide layer will form the connection between them.. this may help u in solving the error..
Thanks
Hi
Sorry but I beg to differ, yes salicide is used to increase the resistance of an area of poly. Silicide is placed over poly and CONTACTS to decrease the resistance, most processes allow a salicde block ie NO salicide to increase the resistance of the poly for a resistor. I am interested why you think you can connect active areas together using salicide and what advantage this has and how it would drc & lvs, I have never heard of it ( layout eng for 8 yrs)
Salicide is used to increase the resistance.
I am aware of the use of Salicide (or for that matter salicide blockage as pointed by k_90, because Salicide is a negative mask as provided by the foundries) in layouts of ESD protection devices.
The salicide is not added onto the surface of the ESD device to provide high resistance on teh surface for uniform heating. But the contacts and poly have the salicide below them to provide a low resistance path for current to flow down.
Yup, this is how people get confused. Lets clear this up:
1 - Salicide is a Self-alligned silicide. To make silicide they deposit metal on top of the silicon and heat it up, causing the silicon to go down in resistance. Therefore Salicide is used to reduce the resistance of silicon, poly, etc...
2 - By default, they use salicide everywhere since for digital circuits this is an advantage. For analog circuits, we sometimes want high resistance (resistors). Also, MOS with salicide have much worse matching, therefore analog guys sometimes don't want the salicide. Hence they created a salicide blocking mask.
3 - The salicide blocking mask is also often called salicide in the layout engine. This can lead to confusion. Some people then assume that Salicide increases resistance, when in fact salicide decreases resistance. The salicide in the layout does increase the resistance because it blocks out salicide.
This site uses cookies to help personalise content, tailor your experience and to keep you logged in if you register.
By continuing to use this site, you are consenting to our use of cookies.