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rule of thumb regarding electromigration in 0.35um process...

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A good rule of thumb is 1E5 A/cm2 for a decent AlSiCu or AlSi
interconnect. But you have to know your worst case cross
section, which is seldom anything like the as-depositied flat
field thickness, and if you have tungsten plug vias those can
kill your rating too if the resulting, degraded rules are applied
to the metal rather than the via feature.

In any case data beats speculation and the data will be fab
dependent.
 
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