jimmykk
Full Member level 3
Hi
I want to replace obsolete component in TSOP-28 (0.55mm pitch, 13.4 x 8mm package) with SOIC-8 (1.27mm pitch, 5x6mm size) on my PCB. The TSOP package has all the 8 pins which I need on the left side of package. The way I see to replace this package is to make a very small rigid flex PCB with only the new SOIC8 package soldered on rigid PCB and the flex part having plated vias(in a row) connecting to the pads of TSOP. Is this practically possible or pitch of TSOP too small for the via soldering.
any other ideas?
I want to replace obsolete component in TSOP-28 (0.55mm pitch, 13.4 x 8mm package) with SOIC-8 (1.27mm pitch, 5x6mm size) on my PCB. The TSOP package has all the 8 pins which I need on the left side of package. The way I see to replace this package is to make a very small rigid flex PCB with only the new SOIC8 package soldered on rigid PCB and the flex part having plated vias(in a row) connecting to the pads of TSOP. Is this practically possible or pitch of TSOP too small for the via soldering.
any other ideas?