Re Flow Oven temperature and time

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expertengr

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We have re-flow oven which has preheating temperature C1 and preheating time T1. Similarly, C2 and T2 is for actual re-flow. I am wondering how to setup temperature-time profile for SMD components, no component is especial. These components can be soldered with normal Sn63 solder paste. The re-flow oven can go up to 260 C.

How the following profile look like ?

C1: 150 C
T1: 240 sec (4 min)

C2: 260 C
T2: 240 sec (4 min)
 

"expertengr"? Pretty pretentious name.

I'm not an expert, but your profile will depend on a LOT of things. What components are you soldering? How densely are they populated? What are the PCB characteristics? And I think your 4 minutes of reflow time is excessive.
 
Reactions: d123

    d123

    Points: 2
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Assumption: There is no critical component on the PCB. How about the following settings ?

C1: 150 C
T1: 150 sec (2.5 min)

C2: 260 C
T2: 180 sec (3 min)
 

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