Prashanthanilm
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These are few questions:
1.In 28nm tech, HKMG technology is used, i.e, instead of using PolySi they use metal for gate. Its given that it helps adjust the gate to low threshold voltage. How?
2.Channel length is reduced and kept at particular nodes, say 180nm,130nm and so on. How is this particular node decided?
3.Except for area , is there any other advantage of STI over LOCOS?
4.Variation of drain saturation current is more for 28nm tech. How is it useful?
5.Why is Cu used for vias in 28nm tech?
6.What is poly spacing effect?
7.High sheet resistance reduces threshold voltage. How?
8.Why are spacers of silicides used?
Thanks in Advance.
1.In 28nm tech, HKMG technology is used, i.e, instead of using PolySi they use metal for gate. Its given that it helps adjust the gate to low threshold voltage. How?
2.Channel length is reduced and kept at particular nodes, say 180nm,130nm and so on. How is this particular node decided?
3.Except for area , is there any other advantage of STI over LOCOS?
4.Variation of drain saturation current is more for 28nm tech. How is it useful?
5.Why is Cu used for vias in 28nm tech?
6.What is poly spacing effect?
7.High sheet resistance reduces threshold voltage. How?
8.Why are spacers of silicides used?
Thanks in Advance.