Feb 18, 2008 #1 L lssdpoly Newbie level 5 Joined Jun 30, 2007 Messages 9 Helped 0 Reputation 0 Reaction score 0 Trophy points 1,281 Activity points 1,336 Who can answer my question? Thanks.
Feb 18, 2008 #2 k_90 Full Member level 2 Joined Jan 25, 2006 Messages 144 Helped 27 Reputation 54 Reaction score 10 Trophy points 1,298 Location Scotland,GB Activity points 2,154 The bump technique employs a unique layer at the top level of the chip which is thicker and has a very low resistance compared to bond pads. It is used to save bonding space and lowers the resitance of the i/os' by having no bonding lead.
The bump technique employs a unique layer at the top level of the chip which is thicker and has a very low resistance compared to bond pads. It is used to save bonding space and lowers the resitance of the i/os' by having no bonding lead.
Feb 18, 2008 #3 R RFCMOS Full Member level 2 Joined May 5, 2005 Messages 143 Helped 20 Reputation 40 Reaction score 0 Trophy points 1,296 Location France Activity points 1,971 Hi, to interconnect the die to the package pad.
Feb 19, 2008 #4 L lssdpoly Newbie level 5 Joined Jun 30, 2007 Messages 9 Helped 0 Reputation 0 Reaction score 0 Trophy points 1,281 Activity points 1,336 Thank you for your answer.
Feb 19, 2008 #5 S sandeep_torgal Full Member level 2 Joined Jan 2, 2008 Messages 123 Helped 13 Reputation 26 Reaction score 4 Trophy points 1,298 Activity points 1,873 Some more info on bump