DaveZurich
Newbie
Hi guys and girls,
I'm new to the Forum. Irish guy living in Zurich for the last 10 years.
I have specifically registered to ask for your help. I have a JCD8898 at 450°C with flow rate 50% and I am not able to desolder the PS4 Wi-Fi/Bluetooth BGA chip.
I did have a large opening nozzle on the hotair gun, which didn't work. I removed the nozzle, so I could get maximum heat to the full area of the chip. That's when the cap came off the package. I'm not concerned that the shielding has come loose I'm concerned that the solder won't let go. There's very little space to get low melt solder in place perhaps that's what I need to do next?
I've watched a lot of YouTube videos and the desoldering seemed quite straightforward.
Please help and give me some guidance...
I'm new to the Forum. Irish guy living in Zurich for the last 10 years.
I have specifically registered to ask for your help. I have a JCD8898 at 450°C with flow rate 50% and I am not able to desolder the PS4 Wi-Fi/Bluetooth BGA chip.
I did have a large opening nozzle on the hotair gun, which didn't work. I removed the nozzle, so I could get maximum heat to the full area of the chip. That's when the cap came off the package. I'm not concerned that the shielding has come loose I'm concerned that the solder won't let go. There's very little space to get low melt solder in place perhaps that's what I need to do next?
I've watched a lot of YouTube videos and the desoldering seemed quite straightforward.
Please help and give me some guidance...