leolib2004
Junior Member level 3
Hi,
I would like to check if I doing this well. I am designing a board which has a samS70 controller (100 pin LQFP version) that uses i2s, i2c, SPI and usb (but the connector is next to the SAM device). There is a wifi module next to the SAM as well (ATWiNC1500-MR210PB).
I have done most of the routing on top and reached a 80mm x 80mm board. And will place:
- A big ground plane on bottom except on where the WIFIMOD is located.
- Avoid vias in the signals lines and route them using 12 mils as the width
- I have 5 lines going in parallel (i2c , SDOUT, SDIN and TF of the codec). I won't add gnd in between them and let the gap be at least 3 times the trace width (12mils x 3). There will be some ground in the bottom below them.
- Add a ground plane on top too only in the part that is between the audio codec and the audio jack.
How does it look to you? It looks fine for me...
I would like to check if I doing this well. I am designing a board which has a samS70 controller (100 pin LQFP version) that uses i2s, i2c, SPI and usb (but the connector is next to the SAM device). There is a wifi module next to the SAM as well (ATWiNC1500-MR210PB).
I have done most of the routing on top and reached a 80mm x 80mm board. And will place:
- A big ground plane on bottom except on where the WIFIMOD is located.
- Avoid vias in the signals lines and route them using 12 mils as the width
- I have 5 lines going in parallel (i2c , SDOUT, SDIN and TF of the codec). I won't add gnd in between them and let the gap be at least 3 times the trace width (12mils x 3). There will be some ground in the bottom below them.
- Add a ground plane on top too only in the part that is between the audio codec and the audio jack.
How does it look to you? It looks fine for me...